Design and achievement of superfilling electroless silver deposition for micrometer trenches.

Wang, Xu; Ma, Weiwu; Fernandez, Carlos

Abstract

Electroless silver bottom-up filling has been designed and investigated by linear sweep voltammetry. It was found that the addition of polyethylene glycol 4000 (PEG 4000) had a good inhibitory effect on the electrode reaction. Experiments showed that PEG 4000 had a strong depressing action in electroless silver deposition. Specifically, when the PEG 4000 concentration was 1.0 mg/L, the plating rate of electroless silver decreased from 5.7 to 2.3 μm/h. The bottom-up silver fillings for different-sized trenches were achieved in an electroless plating bath with the addition of PEG 4000. The trenches analysis showed that all microtrenches with different widths were completely filled by electroless silver plating.

Citation

WANG, X., MA, W. and FERNANDEZ, C. 2023. Design and achievement of superfilling electroless silver deposition for micrometer trenches. Surface engineering and applied electrochemistry [online], 59(1), pages 15-19. Available from: https://doi.org/10.3103/S1068375523010143

• Journal Article Type: Article
• Acceptance Date: Sep 7, 2022
• Online Publication Date: Apr 4, 2023
• Publication Date: Feb 28, 2023
• Deposit Date: May 23, 2023
• Publicly Available Date: Feb 29, 2024
• Journal: Surface engineering and applied electrochemistry
• Print ISSN: 1068-3755
• Electronic ISSN: 1934-8002
• Publisher: Springer
• Peer Reviewed: Peer Reviewed
• Volume: 59
• Issue: 1
• Pages: 15-19
• DOI: https://doi.org/10.3103/S1068375523010143
• Keywords: Silver deposition; Bottom-up filling; Microtrenches
• Public URL: https://rgu-repository.worktribe.com/output/1947625