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Atomistic investigation on the structure-property relationship during thermal spray nanoparticle impact.

Goel, Saurav; Faisal, Nadimul Haque; Ratia, Vilma; Agrawal, Anupam; Stukowski, Alexander

Authors

Saurav Goel

Vilma Ratia

Anupam Agrawal

Alexander Stukowski



Abstract

During thermal spraying, hot particles impact on a colder substrate. This interaction of crystalline copper nanoparticles and copper substrate is modeled, using MD simulation. The quantitative results of the impacts at different velocities and temperatures are evaluated using a newly defined flattening aspect ratio. This ratio between the maximum diameter after the impact and the height of the splat increases with increasing Reynolds numbers until a critical value is reached. At higher Reynolds numbers the flattening aspect ratio decreases again, as the kinetic energy of the particle leads to increasing substrate temperature and, therefore, decreases the substrate resistance. Thus, the particle penetrates into the substrate and deforms less.

Citation

GOEL, S., FAISAL, N.H., RATIA, V., AGRAWAL, A. and STUKOWSKI, A. 2014. Atomistic investigation on the structure-property relationship during thermal spray nanoparticle impact. Computational materials science [online], 84, pages 163-174. Available from: https://doi.org/10.1016/j.commatsci.2013.12.011

Journal Article Type Article
Acceptance Date Dec 31, 2013
Online Publication Date Dec 31, 2013
Publication Date Mar 31, 2014
Deposit Date May 25, 2016
Publicly Available Date Mar 29, 2024
Journal Computational materials science
Print ISSN 0927-0256
Electronic ISSN 1879-0801
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 84
Pages 163-174
DOI https://doi.org/10.1016/j.commatsci.2013.12.011
Keywords Thermal spray coating; Molecular dynamics; Copper; Particle impact; Flattening aspect ratio
Public URL http://hdl.handle.net/10059/1486

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