Comparison of the self-healing behaviour of 60Sn40Pb and 99.3Sn0.7Cu solder alloy reinforced Al6061 MMCs’.

Mantha, Subrahmanya Ranga Viswanath; Kumar, Gonal Basavaraja Veeresh; Pramod, Ramakrishna; Rao, Chilakalapalli Surya Prakasha; Saharudin, Mohd Shahneel; Sahu, Santosh Kumar

Abstract

The self-healing characteristics of Al6061 reinforced with CuO have been examined experimentally. The solder alloys 60Pb40Sn and 99.3Sn0.7Cu with low melting points are incorporated to strengthen the Al6061 MMCs'; the self-healing properties have been investigated. Developed self-healing samples have undergone testing for hardness, tensile, and impact characteristics in accordance with ASTM standard test protocols. The findings demonstrate how the solder filling affects the mechanical characteristics of self-healed Al6061 alloy and its MMCs'. The results showed that the composites formed a decent bond between the solder and matrix, confirming successful fabrication. Pb-Sn filled samples demonstrated higher self-healing efficiency for tensile and impact of 90.02% and 90.30% with 6 wt.% of CuO, respectively, and Sn-Cu filled samples witnessed higher self-healing efficiency for tensile and impact of 91.81% and 91.09% with 6 wt.% of CuO respectively. However, the self-healed composite did not split in two when subjected to Charpy impact and tensile strength tests, and the healing efficiency of Sn-Cu-filled composites is higher than that of the Pb-Sn-filled composites.

Citation

MANTHA, S.R.V., KUMAR, G.B.V., PRAMOD, R., RAO, C.S.P., SAHARUDIN, M.S. and SAHU, S.K. 2025. Comparison of the self-healing behaviour of 60Sn40Pb and 99.3Sn0.7Cu solder alloy reinforced Al6061 MMCs'. Journal of manufacturing and materials processing [online], 9(5), article number 141. Available from: https://doi.org/10.3390/jmmp9050141

• Journal Article Type: Article
• Acceptance Date: Apr 22, 2025
• Online Publication Date: Apr 24, 2025
• Deposit Date: Apr 28, 2025
• Publicly Available Date: May 8, 2025
• Journal: Journal of Manufacturing and Materials Processing
• Electronic ISSN: 2504-4494
• Publisher: MDPI
• Peer Reviewed: Peer Reviewed
• Volume: 9
• Issue: 5
• Article Number: 141
• DOI: https://doi.org/10.3390/jmmp9050141
• Keywords: Al6061-CuO MMCs'; Self-healing; 60Sn40Pb; 99.3Sn0.7Cu; Solder; Low melting point alloy
• Public URL: https://rgu-repository.worktribe.com/output/2801815